20Mar 2017

EFFECT OF HEATING RATESAND ZN-ADDITION ON THE THERMAL PROPERTIES OFPB–SNALLOY

  • Faculty of Sciences, Department of Physics, Ibb University, Ibb, Yemen.
  • Faculty of Sciences, Department of Physics, Damascus University, Syria.
  • Faculty of civil engineering, Department of basic science, Damascus University, Syria.
Crossref Cited-by Linking logo
  • Abstract
  • Keywords
  • References
  • Cite This Article as
  • Corresponding Author

The variations of thermal properties with temperature for Pb–Sn alloys were measured using a heat flow apparatus.According to present experimental results, the thermal parameters (Tonset, Tend, Tm) of Pb–Sn alloys increase with increasing heating rates, also the results showed that the small amount of zinc improved significantly these parameters. Furthermore the change in enthalpy of fusion and activation energy of fusion for different heating rates were studied experimentally by the differential thermal analysis(DTA). The apparent activation energies of Pb–Sn alloys have been determined based on the Kissinger equation.

  1. C. Flemings, "Solidification processing," Metallurgical transactions, vol. 5, pp. 2121-2134, 1974.
  2. Çad?rl?, H. Kaya, and M. Gündüz, "Directional solidification and characterization of the Cd–Sn eutectic alloy," Journal of alloys and compounds, vol. 431, pp. 171-179, 2007.
  3. El-Daly, Y. Swilem, and A. Hammad, "Creep properties of Sn–Sb based lead-free solder alloys," Journal of Alloys and Compounds, vol. 471, pp. 98-104, 2009.
  4. Guruswamy, Engineering properties and applications of lead alloys: CRC Press, 1999.
  5. El-Daly, A. Abdel-Daiem, and M. Yousf, "Effect of isothermal ageing on the electrical resistivity and microstructure of Pb–Sn–Zn ternary alloys," Materials chemistry and physics, vol. 78, pp. 73-80, 2003.
  6. Ocak, S. Aksöz, N. Mara?l?, and E. Çad?rl?, "Dependency of thermal and electrical conductivity on temperature and composition of Sn in Pb–Sn alloys," Fluid Phase Equilibria, vol. 295, pp. 60-67, 2010.
  7. ÇadIrlI, U. Böyük, H. Kaya, N. Mara?li, S. Aksöz, and Y. Ocak, "Dependence of electrical resistivity on temperature and Sn content in Pb-Sn solders," Journal of electronic materials, vol. 40, pp. 195-200, 2011.
  8. Plevachuk, V. Sklyarchuk, A. Yakymovych, B. Willers, and S. Eckert, "Electronic properties and viscosity of liquid Pb–Sn alloys," Journal of alloys and compounds, vol. 394, pp. 63-68, 2005.
  9. Sakr, A. Mohamed, M. Shehab, and A. Bassyouni, "Microstructure changes and steady state creep characteristics in Pb-Sn alloys during transformation," Czechoslovak journal of physics, vol. 41, pp. 785-792, 1991.
  10. Morando, O. Fornaro, O. Garbellini, and H. Palacio, "Thermal properties of Sn-based solder alloys," Journal of Materials Science: Materials in Electronics, vol. 25, pp. 3440-3447, 2014.
  11. K. Kang and A. K. Sarkhel, "Lead (Pb)-free solders for electronic packaging," Journal of Electronic Materials, vol. 23, pp. 701-707, 1994.
  12. Anderson, "Tin-silver-copper: A lead free solder for broad applications," in NEPCON WEST, 1996, pp. 882-890.
  13. Russell and K. L. Lee, Structure-property relations in nonferrous metals: John Wiley & Sons, 2005.
  14. Gong, X. Wang, and K. Yao, "Effects of alloying elements on crystallization kinetics of Ti–Zr–Be bulk metallic glass," Journal of Materials Science, vol. 51, pp. 5321-5329, 2016.
  15. Fukahori, T. Nomura, C. Zhu, N. Sheng, N. Okinaka, and T. Akiyama, "Thermal analysis of Al–Si alloys as high-temperature phase-change material and their corrosion properties with ceramic materials," Applied Energy, vol. 163, pp. 1-8, 2016.
  16. Baker and H. Okamoto, "Alloy phase diagrams," ASM International, ASM Handbook., vol. 3, p. 501, 1992.
  17. J. Boettinger, U. Kattner, K. Moon, and J. Perepezko, DTA and heat-flux DSC measurements of alloy melting and freezing: Citeseer, 2006.
  18. S. Šimši?, D. Živkovi?, D. Manasijevi?, T. H. Grguri?, Y. Du, M. Goji?, et al., "Thermal analysis and microstructural investigation of Cu-rich alloys in the Cu–Al–Ag system," Journal of alloys and compounds, vol. 612, pp. 486-492, 2014.
  19. Varschavsky and E. Donoso, "A differential scanning calorimetric study of precipitation in Cu 2Be," Thermochimica acta, vol. 266, pp. 257-275, 1995.
  20. Donoso and A. Varschavsky, "Microcalorimetric evaluation of precipitation in Cu–2Be–0.2 Mg," Journal of thermal analysis and calorimetry, vol. 63, pp. 249-266, 2001.
  21. T. Yang and M. Steinberg, "Reaction kinetics and differential thermal analysis," The Journal of Physical Chemistry, vol. 80, pp. 965-968, 1976.
  22. Altuzar and R. Valenzuela, "Avrami and Kissinger theories for crystallization of metallic amorphous alloys," Materials letters, vol. 11, pp. 101-104, 1991.
  23. Lashgari, Z. Chen, X. Liao, D. Chu, M. Ferry, and S. Li, "Thermal stability, dynamic mechanical analysis and nanoindentation behavior of FeSiB (Cu) amorphous alloys," Materials Science and Engineering: A, vol. 626, pp. 480-499, 2015.
  24. M, "Introduction to Thermal Analysis," Wiley, pp. 33-35, 1986.
 

[Ali Alnakhlani, Belqees Hassan, Abdulhafiz Muhammad and Muhammad Ali Al-Hajji. (2017); EFFECT OF HEATING RATESAND ZN-ADDITION ON THE THERMAL PROPERTIES OFPB–SNALLOY Int. J. of Adv. Res. 5 (Mar). 20-27] (ISSN 2320-5407). www.journalijar.com

Ali Alnakhlani
Faculty of Sciences, Department of Physics, Ibb University, Ibb, Yemen

DOI:

Article DOI: 10.21474/IJAR01/3478      
DOI URL: http://dx.doi.org/10.21474/IJAR01/3478

Download Full Paper

Download PDF No. of Downloads: 80 | No. of Views: 123