HTCC APPROACH FOR PACKAGING MEMS ACCELEROMETER SENSORS AND ASSOCIATED ROIC.

  • Accurex Solutions (P) Ltd., # 782, 3rd Main, 1st Cross, BEML Layout, 5th Stage, Rajarajeswari Nagar, Bangalore 560 098, India.
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Problems associated with assembly and packaging of two accelerometer Micro Electro Mechanical Sensors (MEMS) and associated Read Out Integrated Circuit (ROIC) into a single compact package as per customer requirements were discussed, analysed and a High Temperature Co-fired Ceramic (HTCC) solution was suggested.

  1. Analog Devices,?The Five Motion Senses: Using MEMS Inertial Sensing to transform Applications?, http:// analog.com/media/en/technical-docu-mentation/white-papers/The_Five_ Motion_Senses.pdf
  2. Jeron J.M.Zaal, Willem D.van Driel and G.Q.Zhang, ?Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices, Sensors 2010, 10, 3989-4001.
  3. E.Felton, N.Hablutzel, W.A.Webster and K.P.Harney, ?Chip scale packaging of a MEMS accelerometer?, 2004 Proceedings. 54th Electronic Components and Technology Conference, LasVegas, USA, 4-4 June 2004
  4. Doug Sparks, ?NanoGetters?, www. mems-exchange.org/catalog/P3502/file/6b 0193ffd70a/NanoGetters.ppt
  5. Analog Devices, analog.com/en/ mems-sensors/inertial-s.html
  6. LSM303DLH, ?Sensor module: 3-axis accelerometer and 3-axis magnetometer?, Doc ID 16941 Rev 1, Dec.2009, st.com
  7. Ken Gileo, ?MEMS Packaging Update, Advance Packaging 2005, MEMS/MOEMS Pacakging Pub.Mc Graw Hill, July 2005, https://mhebooklibracom/doi/book/10.1036/0071455566
  8. Steven Nasiri, ?Wafer-Scale Packaging and Integration for Low-Cost MEMS Motion Sensor Products?, IWLPC (Wafer-Level Packaging) Conference Proceedings, Pub Sept 17, 2007.
  9. N.Bhat, A Das Gupta, P.R.S.Rao, N.Das Gupta, E.Bhattacharya, K.Sivakumar, V.Vinoth Kumar, L.Helen Anitha, J.D.Joseph, S.P.Madhavi and K.Natarajan, ?Wafer bonding ? A powerful tool for MEMS?, Indian Journal of Pure & Applied Physics, Vol 45, April 2007, p 311-316.
  10. AdTech Ceramics, ?Design Guidelines?, adtechceramics.com/pdf/ AdTech-Ceramics-Design-Guide-Capabilities.pdf.

[K. S. R. C. Murthy. (2018); HTCC APPROACH FOR PACKAGING MEMS ACCELEROMETER SENSORS AND ASSOCIATED ROIC. Int. J. of Adv. Res. 6 (Jul). 537-552] (ISSN 2320-5407). www.journalijar.com

K S R C MURTHY
Accurex Solutions (P) Ltd., # 782, 3rd Main, 1st Cross, BEML Layout, 5th Stage, Rajarajeswari Nagar, Bangalore 560 098, India.

DOI:

Article DOI: 10.21474/IJAR01/7395      
DOI URL: https://dx.doi.org/10.21474/IJAR01/7395

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