Vol. 6 (07) pp. 537-552 DOI: 10.21474/IJAR01/7395

HTCC APPROACH FOR PACKAGING MEMS ACCELEROMETER SENSORS AND ASSOCIATED ROIC.

  • Accurex Solutions (P) Ltd., # 782, 3rd Main, 1st Cross, BEML Layout, 5th Stage, Rajarajeswari Nagar, Bangalore 560 098, India.
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Abstract

Problems associated with assembly and packaging of two accelerometer Micro Electro Mechanical Sensors (MEMS) and associated Read Out Integrated Circuit (ROIC) into a single compact package as per customer requirements were discussed, analysed and a High Temperature Co-fired Ceramic (HTCC) solution was suggested.

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References

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How to Cite This Article

K. S. R. C. Murthy. (2018); HTCC APPROACH FOR PACKAGING MEMS ACCELEROMETER SENSORS AND ASSOCIATED ROIC., Int. J. of Adv. Res., 6 (07), 537-552, ISSN 2320-5407. DOI: https://doi.org/10.21474/IJAR01/7395

Corresponding Author

K S R C MURTHY
Accurex Solutions (P) Ltd., # 782, 3rd Main, 1st Cross, BEML Layout, 5th Stage, Rajarajeswari Nagar, Bangalore 560 098, India.
Creative Commons Attribution 4.0 This work is licensed under a Creative Commons Attribution 4.0 International License.