ELECTRICAL AND MORPHOLOGICAL CHARACTERIZATION OF SOLUTION-PROCESSED GEL PZN-PT PEROVSKITE NANOPARTICLES THIN FILM FOR TRANSISTOR DIELECTRICS
- Laboratoire de Recherche en Sciences Appliquees de Mamou (LaReSA), Institut Superieur de Technologie,Telico, Mamou 063, Guinea.
- Laboratoire de Chimie et de Physique des Materiaux (LCPM), Universite Assane Seck de Ziguinchor, Senegal.
- Department of Photovoltaic, Universite de Labe, Guinea.
- Physics Department, Universite Gamal Abdel Nasser de Conakry, Guinea.
Abstract
Thin film filed effect transistors (TFTs) have drawn significant attention from scientific community as one of the most attractive for low-cost, large area and flexible electronics.In this context, the development of high-k dielectric materials with additional functional properties is essential for low voltage operating and enhancement of device performance. This work presents the investigation of solution processed Pb(Zn1/3Nb2/3)O3 4.5PbTiO3(PZN PT) perovskite nanoparticles thin films, with and without Mn doping, as gate dielectrics for thin film transistor applications. PZN-PT with 1% Mn doped and undoped PZN-PT films were deposited by spin coating on nanostructured doped n-type silicon substrate to form metal-oxide-semiconductor (MOS) structures with top silver contact. SEM analysis shows Mn doping PZN-PT presents a denser and more homogeneous microstructure compared to undoped. Electrical measurements confirmed transistor operating mode and highlighted the effect of ferroelectric polarization on device behavior.
Keywords
Article Analytics
How to Cite This Article
Diallo Abdoul Kadri, Ndioukane Remi , Diallo Alpha Issa, Sakho Adama Moussa, Toupouvogui Jean Ouere, Tall Abdoulaye, Bahmariama and Kobor Diouma (2026); ELECTRICAL AND MORPHOLOGICAL CHARACTERIZATION OF SOLUTION-PROCESSED GEL PZN-PT PEROVSKITE NANOPARTICLES THIN FILM FOR TRANSISTOR DIELECTRICS, Int. J. of Adv. Res., 14 (02), 1036-1042, ISSN 2320-5407. DOI: https://doi.org/10.21474/IJAR01/22824
Corresponding Author
This work is licensed under a Creative Commons Attribution 4.0 International License.





