NUMERICAL SIMULATION OF OPTIMIZED HEAT SINK DESIGNS FOR ENHANCED THERMAL MANAGEMENT OF ELECTRONICS

Modern electronic devices pack increasing amounts of power into shrinking form factors, and the heat they generate remains a primary cause of premature failure and performance degradation. Among the various thermal management strategies available, passive heat sinks remain a go-to solution because they require no external power and require virtually no maintenance. In this work, two rectangular-fin heat sink layouts are examined side by side: a baseline design with 10 fins and a modified variant with 12 thinner, taller, and more closely spaced fins. Each geometry is evaluated in both aluminum and copper, producing four distinct configurations.